Sikadur 30 is a solvent-free, thixotropic, structural two part adhesive for bonding reinforcement, based on a combination of epoxy resins and special filler, designed for use at normal temperatures between +8°C and +35°C.
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Sikadur 30 is a solvent-free, thixotropic, structural two part adhesive for bonding reinforcement, based on a combination of epoxy resins and special filler, designed for use at normal temperatures between +8°C and +35°C.
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